Issued Patents All Time
Showing 1–25 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Zhiwei Gong, Rushik P. Tank, Kabir Mirpuri, Betty Hill-Shan Yeung | 2025-09-02 |
| 12381164 | Semiconductor device with enclosed cavity and method therefor | Michael B. Vincent | 2025-08-05 |
| 12288766 | Semiconductor device with open cavity and method therefor | Michael B. Vincent | 2025-04-29 |
| 12243842 | Semiconductor device with open cavity and method therefor | Michael B. Vincent | 2025-03-04 |
| 12125716 | Semiconductor device packaging warpage control | Zhiwei Gong, Michael B. Vincent, Vivek Gupta, Richard Te Gan | 2024-10-22 |
| 12119316 | Patterned and planarized under-bump metallization | Namrata Kanth, Paul Southworth, Dwight L. Daniels, Yufu Liu, Jeroen Johannes Maria Zaal +1 more | 2024-10-15 |
| 12033950 | Semiconductor device with self-aligned waveguide and method therefor | Michael B. Vincent, Antonius Hendrikus Jozef Kamphuis | 2024-07-09 |
| 11961776 | Semiconductor device with connector in package and method therefor | Michael B. Vincent | 2024-04-16 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Zhiwei Gong, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |
| 11837560 | Semiconductor device with waveguide and method therefor | Michael B. Vincent, Giorgio Carluccio, Maristella Spella | 2023-12-05 |
| 11823968 | Semiconductor device package having stress isolation and method therefor | Michael B. Vincent, Stephen R. Hooper | 2023-11-21 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Zhiwei Gong, Kabir Mirpuri, Rushik P. Tank, Betty Hill-Shan Yeung | 2023-11-14 |
| 11791283 | Semiconductor device packaging warpage control | Michael B. Vincent, Zhiwei Gong, Richard Te Gan, Vivek Gupta | 2023-10-17 |
| 11760623 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Michael B. Vincent, Julien Juéry | 2023-09-19 |
| 11728285 | Semiconductor device packaging warpage control | Vivek Gupta, Michael B. Vincent, Richard Te Gan, Zhiwei Gong | 2023-08-15 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Zhiwei Gong, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2023-01-17 |
| 11557544 | Semiconductor device having a translation feature and method therefor | Michael B. Vincent, Giorgio Carluccio | 2023-01-17 |
| 11498829 | No-gel pressure sensor package | Stephen R. Hooper, Mark E. Schlarmann, Michael B. Vincent, Julien Juéry | 2022-11-15 |
| 11404288 | Semiconductor device packaging warpage control | Michael B. Vincent, Zhiwei Gong, Vivek Gupta, Richard Te Gan | 2022-08-02 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Michael B. Vincent, Zhiwei Gong, Stephen R. Hooper | 2022-05-17 |
| 11133273 | Semiconductor device with waveguide and method therefor | Michael B. Vincent, Giorgio Carluccio, Maristella Spella | 2021-09-28 |
| 11031681 | Package integrated waveguide | Michael B. Vincent, Zhiwei Gong, Stephen R. Hooper, Pascal Oberndorff, Walter Parmon | 2021-06-08 |
| 10834817 | Plated opening with vent path | Michael B. Vincent, Zhiwei Gong | 2020-11-10 |
| 10651541 | Package integrated waveguide | Walter Parmon | 2020-05-12 |
| 10388607 | Microelectronic devices with multi-layer package surface conductors and methods of their fabrication | Zhiwei Gong, Michael B. Vincent | 2019-08-20 |