Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211177 | High power semiconductor package subsystems | Lakshminarayan Viswanathan, Scott D. Marshall, Mahesh K. Shah | 2019-02-19 |
| 10163874 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Zhiwei Gong | 2018-12-25 |
| 10143084 | Plated opening with vent path | Michael B. Vincent, Zhiwei Gong | 2018-11-27 |
| 10074614 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Michael B. Vincent | 2018-09-11 |
| 9997492 | Optically-masked microelectronic packages and methods for the fabrication thereof | Weng F. Yap, Alan J. Magnus | 2018-06-12 |
| 9960149 | Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication | Michael B. Vincent | 2018-05-01 |
| 9799636 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Zhiwei Gong | 2017-10-24 |
| 9761565 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Michael B. Vincent | 2017-09-12 |
| 9673162 | High power semiconductor package subsystems | Lakshminarayan Viswanathan, Scott D. Marshall, Mahesh K. Shah | 2017-06-06 |
| 9673150 | EMI/RFI shielding for semiconductor device packages | Zhiwei Gong, Michael B. Vincent | 2017-06-06 |
| 9595485 | Microelectronic packages having embedded sidewall substrates and methods for the producing thereof | Michael B. Vincent | 2017-03-14 |
| 9570387 | Three-dimensional integrated circuit systems in a package and methods therefor | Zhiwei Gong, Michael B. Vincent | 2017-02-14 |
| 9548280 | Solder pad for semiconductor device package | Vijay Sarihan, Zhiwei Gong | 2017-01-17 |
| 9520323 | Microelectronic packages having trench vias and methods for the manufacture thereof | Michael B. Vincent, Zhiwei Gong, Douglas G. Mitchell | 2016-12-13 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Alan J. Magnus, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9355985 | Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof | Michael B. Vincent | 2016-05-31 |
| 9312206 | Semiconductor package with thermal via and method for fabrication thereof | Weng F. Yap | 2016-04-12 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |
| 9263420 | Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication | Michael B. Vincent | 2016-02-16 |
| 9257415 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Jason Wright, Zhiwei Gong | 2016-02-09 |
| 9190390 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Zhiwei Gong, Michael B. Vincent, Jason Wright | 2015-11-17 |
| 9142434 | Method for singulating electronic components from a substrate | Wei Gao, Craig Amrine, Zhiwei Gong, Lizabeth Keser, George R. Leal +1 more | 2015-09-22 |
| 9142502 | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits | Zhiwei Gong, Navjot Chhabra, Glenn G. Daves, Douglas G. Mitchell, Jason Wright | 2015-09-22 |
| 9107303 | Warp compensated electronic assemblies | William H. Lytle, George R. Leal | 2015-08-11 |
| 9093457 | Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof | Zhiwei Gong, Michael B. Vincent, Jason Wright | 2015-07-28 |