Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431534 | Package with support structure | Nishant Lakhera, Gilles Montoriol, Akhilesh Kumar Singh, Navas Khan Oratti Kalandar | 2019-10-01 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |
| 7834466 | Semiconductor die with die pad pattern | Robert J. Wenzel, Ilan Lidsky | 2010-11-16 |