Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406896 | Semiconductor device package having thermal dissipation feature and method therefor | Scott M. Hayes, Michael B. Vincent, Rushik P. Tank, Kabir Mirpuri, Betty Hill-Shan Yeung | 2025-09-02 |
| 12387985 | Semiconductor device with cavity carrier and method therefor | Kuan-Hsiang Mao, Neil T. Tracht | 2025-08-12 |
| 12184237 | Surface-mount amplifier devices | Lu Ll, Li Ll, Lakshminarayan Viswanathan, Fernando A. Santos, Elie A. Maalouf +1 more | 2024-12-31 |
| 12125716 | Semiconductor device packaging warpage control | Scott M. Hayes, Michael B. Vincent, Vivek Gupta, Richard Te Gan | 2024-10-22 |
| 12040291 | Radio frequency packages containing multilevel power substrates and associated fabrication methods | Li Li, Lu Li, Lakshminarayan Viswanathan, Fernando A. Santos, Burton J. Carpenter | 2024-07-16 |
| 11967507 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Rushik P. Tank, Burton J. Carpenter, Jinmei Liu | 2024-04-23 |
| 11935809 | Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements | Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2024-03-19 |
| 11847469 | Intelligent device and method for controlling boot screen of the intelligent device | Tao Dong, Lei Qian, Yingwei Long, Lianghu Su, Siming W. Chen +1 more | 2023-12-19 |
| 11817366 | Semiconductor device package having thermal dissipation feature and method therefor | Michael B. Vincent, Scott M. Hayes, Kabir Mirpuri, Rushik P. Tank, Betty Hill-Shan Yeung | 2023-11-14 |
| 11791283 | Semiconductor device packaging warpage control | Scott M. Hayes, Michael B. Vincent, Richard Te Gan, Vivek Gupta | 2023-10-17 |
| 11728285 | Semiconductor device packaging warpage control | Vivek Gupta, Michael B. Vincent, Scott M. Hayes, Richard Te Gan | 2023-08-15 |
| 11557525 | Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements | Scott M. Hayes, Michael B. Vincent, Betty Hill-Shan Yeung, Rushik P. Tank, Kabir Mirpuri | 2023-01-17 |
| 11404288 | Semiconductor device packaging warpage control | Michael B. Vincent, Scott M. Hayes, Vivek Gupta, Richard Te Gan | 2022-08-02 |
| 11335652 | Method, system, and apparatus for forming three-dimensional semiconductor device package with waveguide | Michael B. Vincent, Scott M. Hayes, Stephen R. Hooper | 2022-05-17 |
| 11297246 | Photography control method, device, non-transitory storage medium and system of intelligent photography system | Yu Lu, Bin Chen, Yong Li, Yuni Chen, Xinyu Ye +1 more | 2022-04-05 |
| 11245854 | Intelligent photography system | Wenming Tang, Bin Chen, Yong Li, Yu Lu, Yuni Chen +3 more | 2022-02-08 |
| 11222790 | Tie bar removal for semiconductor device packaging | Richard Te Gan, Rushik P. Tank, Burton J. Carpenter, Jinmei Liu | 2022-01-11 |
| 11121467 | Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process | Jinbang Tang, Betty Hill-Shan Yeung, Michael B. Vincent | 2021-09-14 |
| 11031681 | Package integrated waveguide | Michael B. Vincent, Scott M. Hayes, Stephen R. Hooper, Pascal Oberndorff, Walter Parmon | 2021-06-08 |
| 10937750 | Low stress pad structure for packaged devices | Paul Southworth | 2021-03-02 |
| 10834817 | Plated opening with vent path | Michael B. Vincent, Scott M. Hayes | 2020-11-10 |
| 10388607 | Microelectronic devices with multi-layer package surface conductors and methods of their fabrication | Scott M. Hayes, Michael B. Vincent | 2019-08-20 |
| 10283477 | Method of fabricating 3-dimensional fan-out structure | Wei Gao, Dehong Ye | 2019-05-07 |
| 10163874 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Scott M. Hayes | 2018-12-25 |
| 10143084 | Plated opening with vent path | Michael B. Vincent, Scott M. Hayes | 2018-11-27 |