Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083912 | Method of packaging integrated circuit die and device | Wei Gao | 2018-09-25 |
| 10074614 | EMI/RFI shielding for semiconductor device packages | Scott M. Hayes, Michael B. Vincent | 2018-09-11 |
| 10068841 | Apparatus and methods for multi-die packaging | Wei Gao | 2018-09-04 |
| 9899298 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Jason Wright | 2018-02-20 |
| 9799636 | Packaged devices with multiple planes of embedded electronic devices | Michael B. Vincent, Scott M. Hayes | 2017-10-24 |
| 9721881 | Apparatus and methods for multi-die packaging | Wei Gao | 2017-08-01 |
| 9673150 | EMI/RFI shielding for semiconductor device packages | Scott M. Hayes, Michael B. Vincent | 2017-06-06 |
| 9607918 | Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof | Weng F. Yap | 2017-03-28 |
| 9570387 | Three-dimensional integrated circuit systems in a package and methods therefor | Scott M. Hayes, Michael B. Vincent | 2017-02-14 |
| 9548280 | Solder pad for semiconductor device package | Vijay Sarihan, Scott M. Hayes | 2017-01-17 |
| 9520323 | Microelectronic packages having trench vias and methods for the manufacture thereof | Michael B. Vincent, Scott M. Hayes, Douglas G. Mitchell | 2016-12-13 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Scott M. Hayes, Alan J. Magnus, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9362211 | Exposed pad integrated circuit package with mold lock | Wei Gao, Yanting Tian, Jinzhong Yao, Dehong Ye | 2016-06-07 |
| 9331029 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Jason Wright | 2016-05-03 |
| 9281284 | System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof | Weng F. Yap | 2016-03-08 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Scott M. Hayes, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |
| 9257415 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Scott M. Hayes, Jason Wright | 2016-02-09 |
| 9257393 | Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof | Weng F. Yap | 2016-02-09 |
| 9190390 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Scott M. Hayes, Jason Wright | 2015-11-17 |
| 9142434 | Method for singulating electronic components from a substrate | Wei Gao, Craig Amrine, Scott M. Hayes, Lizabeth Keser, George R. Leal +1 more | 2015-09-22 |
| 9142502 | Semiconductor device packaging having pre-encapsulation through via formation using drop-in signal conduits | Navjot Chhabra, Glenn G. Daves, Scott M. Hayes, Douglas G. Mitchell, Jason Wright | 2015-09-22 |
| 9093457 | Stacked microelectronic packages having patterned sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Scott M. Hayes, Jason Wright | 2015-07-28 |
| 9036363 | Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication | Michael B. Vincent | 2015-05-19 |
| 9034697 | Apparatus and methods for quad flat no lead packaging | Jianwen Xu, Wei Gao, Scott M. Hayes | 2015-05-19 |
| 9000589 | Semiconductor device with redistributed contacts | Dominic Koey | 2015-04-07 |