Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424521 | Programmable stitch chaining of die-level interconnects for reliability testing | — | 2019-09-24 |
| 9640469 | Matrix lid heatspreader for flip chip package | Tim V. Pham | 2017-05-02 |
| 9159643 | Matrix lid heatspreader for flip chip package | Tim V. Pham | 2015-10-13 |
| 9142434 | Method for singulating electronic components from a substrate | Wei Gao, Craig Amrine, Zhiwei Gong, Scott M. Hayes, Lizabeth Keser +1 more | 2015-09-22 |
| 9107303 | Warp compensated electronic assemblies | William H. Lytle, Scott M. Hayes | 2015-08-11 |
| 8970026 | Methods and structures for reducing stress on die assembly | Leo M. Higgins, III, Tim V. Pham | 2015-03-03 |
| 8877523 | Recovery method for poor yield at integrated circuit die panelization | — | 2014-11-04 |
| 8829661 | Warp compensated package and method | William H. Lytle, Scott M. Hayes | 2014-09-09 |
| 8368172 | Fused buss for plating features on a semiconductor die | Kevin J. Hess, Trent S. Uehling | 2013-02-05 |
| 8349666 | Fused buss for plating features on a semiconductor die | Kevin J. Hess, Trent S. Uehling | 2013-01-08 |
| 8216918 | Method of forming a packaged semiconductor device | Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell, Jason Wright, Jianwen Xu | 2012-07-10 |
| 8072062 | Circuit device with at least partial packaging and method for forming | Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more | 2011-12-06 |
| 7950144 | Method for controlling warpage in redistributed chip packaging panels | Lakshmi N. Ramanathan, Douglas G. Mitchell, Betty Hill-Shan Yeung | 2011-05-31 |
| 7892882 | Methods and apparatus for a semiconductor device package with improved thermal performance | Victor A. Chiriac, Tien-Yu Lee, Marc Alan Mangrum, Robert J. Wenzel | 2011-02-22 |
| 7579219 | Semiconductor device with a protected active die region and method therefor | Owen R. Fay, Robert J. Wenzel | 2009-08-25 |
| 7553753 | Method of forming crack arrest features in embedded device build-up package and package thereof | Jie Zhao, Robert J. Wenzel, Scott K. Pozder | 2009-06-30 |
| 7528069 | Fine pitch interconnect and method of making | Robert J. Wenzel | 2009-05-05 |
| 7405102 | Methods and apparatus for thermal management in a multi-layer embedded chip structure | Tien-Yu Lee, Craig Amrine, Victor A. Chiriac, Lizabeth Keser, Robert J. Wenzel | 2008-07-29 |
| 7361987 | Circuit device with at least partial packaging and method for forming | Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more | 2008-04-22 |
| 7271013 | Semiconductor device having a bond pad and method therefor | Lois Yong, Peter R. Harper, Tu-Anh N. Tran, Jeffrey W. Metz, Dieu Van Dinh | 2007-09-18 |
| 6921975 | Circuit device with at least partial packaging, exposed active surface and a voltage reference plane | Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more | 2005-07-26 |
| 6844631 | Semiconductor device having a bond pad and method therefor | Lois Yong, Peter R. Harper, Tu-Anh N. Tran, Jeffrey W. Metz, Dieu Dinh | 2005-01-18 |
| 6838776 | Circuit device with at least partial packaging and method for forming | Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer, David G. Wontor +1 more | 2005-01-04 |