Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10643912 | Chip package interaction (CPI) back-end-of-line (BEOL) monitoring structure and method | Eng Chye Chua | 2020-05-05 |
| 10566300 | Bond pads with surrounding fill lines | Thiagarajan Raman, Kristina Young-Fisher, David B. Stone | 2020-02-18 |
| 8581383 | 3-D semiconductor die structure with containing feature and method | Ritwik Chatterjee | 2013-11-12 |
| 7811932 | 3-D semiconductor die structure with containing feature and method | Ritwik Chatterjee | 2010-10-12 |
| 7622309 | Mechanical integrity evaluation of low-k devices with bump shear | Peng Su, David G. Wontor, Jie Zhao | 2009-11-24 |
| 7622313 | Fabrication of three dimensional integrated circuit employing multiple die panels | Robert E. Jones | 2009-11-24 |
| 7553753 | Method of forming crack arrest features in embedded device build-up package and package thereof | Jie Zhao, George R. Leal, Robert J. Wenzel | 2009-06-30 |
| 7535078 | Semiconductor device having a fuse and method of forming thereof | Thomas S. Kobayashi, Stephen G. Sheck | 2009-05-19 |
| 7378339 | Barrier for use in 3-D integration of circuits | Lynne Michaelson, Varughese Mathew | 2008-05-27 |
| 7358616 | Semiconductor stacked die/wafer configuration and packaging and method thereof | Syed M. Alam, Robert E. Jones | 2008-04-15 |
| 7276435 | Die level metal density gradient for improved flip chip package reliability | Kevin J. Hess, Ruiqi Tian, Edward O. Travis, Trent S. Uehling, Brett P. Wilkerson +1 more | 2007-10-02 |
| 7247552 | Integrated circuit having structural support for a flip-chip interconnect pad and method therefor | Kevin J. Hess, Pak K. Leung, Edward O. Travis, Brett P. Wilkerson, David G. Wontor +1 more | 2007-07-24 |
| 7169694 | Method for forming a bond pad interface | Thomas S. Kobayashi | 2007-01-30 |
| 7153726 | Semiconductor device with magnetically permeable heat sink | Michelle F. Rasco | 2006-12-26 |
| 7041576 | Separately strained N-channel and P-channel transistors | Salih Muhsin Celik, Byoung W. Min, Vance H. Adams | 2006-05-09 |
| 6958548 | Semiconductor device with magnetically permeable heat sink | Michelle F. Rasco | 2005-10-25 |
| 6951801 | Metal reduction in wafer scribe area | Trent S. Uehling, Lakshmi N. Ramanathan | 2005-10-04 |
| 6803302 | Method for forming a semiconductor device having a mechanically robust pad interface | Thomas S. Kobayashi | 2004-10-12 |
| 6531384 | Method of forming a bond pad and structure thereof | Thomas S. Kobayashi | 2003-03-11 |
| 6429531 | Method and apparatus for manufacturing an interconnect structure | Addi B. Mistry, Rina Chowdhury, Deborah Hagen, Rebecca G. Cole, Kartik Ananthanarayanan +1 more | 2002-08-06 |
| 6420208 | Method of forming an alternative ground contact for a semiconductor die | Harold Downey, Thomas S. Kobayashi | 2002-07-16 |
| 6294458 | Semiconductor device adhesive layer structure and process for forming structure | Jiming Zhang, Dean J. Denning, Sam S. Garcia | 2001-09-25 |