Issued Patents All Time
Showing 1–25 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014257 | Apparatus and method for placing stressors within an integrated circuit device to manage electromigration failures | Douglas M. Reber, Mehul D. Shroff | 2018-07-03 |
| 9685405 | Fuse/resistor utilizing interconnect and vias and method of making | Mehul D. Shroff, Douglas M. Reber | 2017-06-20 |
| 9652577 | Integrated circuit design using pre-marked circuit element object library | Ertugrul Demircan, Douglas M. Reber, Michael A. Stockinger | 2017-05-16 |
| 9515006 | 3D device packaging using through-substrate posts | Douglas M. Reber, Mehul D. Shroff | 2016-12-06 |
| 9508702 | 3D device packaging using through-substrate posts | Douglas M. Reber, Mehul D. Shroff | 2016-11-29 |
| 9508701 | 3D device packaging using through-substrate pillars | Douglas M. Reber, Mehul D. Shroff | 2016-11-29 |
| 9455220 | Apparatus and method for placing stressors on interconnects within an integrated circuit device to manage electromigration failures | Mehul D. Shroff, Douglas M. Reber | 2016-09-27 |
| 9443804 | Capping layer interface interruption for stress migration mitigation | Mehul D. Shroff, Douglas M. Reber | 2016-09-13 |
| 9445050 | Teleconferencing environment having auditory and visual cues | Douglas M. Reber | 2016-09-13 |
| 9318409 | Integrated circuit heater for reducing stress in the integrated circuit material and chip leads of the integrated circuit, and for optimizing performance of devices of the integrated circuit | Douglas M. Reber, Mehul D. Shroff | 2016-04-19 |
| 9245817 | Semiconductor device with embedded heat spreading | Douglas M. Reber, Mehul D. Shroff | 2016-01-26 |
| 9236344 | Thin beam deposited fuse | Douglas M. Reber, Mehul D. Shroff | 2016-01-12 |
| 9142507 | Stress migration mitigation utilizing induced stress effects in metal trace of integrated circuit device | Mehul D. Shroff, Douglas M. Reber | 2015-09-22 |
| 9122829 | Stress migration mitigation | Douglas M. Reber, Mehul D. Shroff | 2015-09-01 |
| 9122812 | Semiconductor device with vias on a bridge connecting two buses | Douglas M. Reber, Mehul D. Shroff | 2015-09-01 |
| 9082824 | Method for forming an electrical connection between metal layers | Douglas M. Reber, Mehul D. Shroff | 2015-07-14 |
| 9064785 | Electronic device including a capacitor and a process of forming the same | Bradley P. Smith | 2015-06-23 |
| 9032615 | Method for forming an electrical connection between metal layers | Douglas M. Reber, Mehul D. Shroff | 2015-05-19 |
| 8972922 | Method for forming an electrical connection between metal layers | Douglas M. Reber, Mehul D. Shroff | 2015-03-03 |
| 8946000 | Method for forming an integrated circuit having a programmable fuse | Douglas M. Reber, Mehul D. Shroff | 2015-02-03 |
| 8941242 | Method of protecting against via failure and structure therefor | Mehul D. Shroff, Douglas M. Reber | 2015-01-27 |
| 8856705 | Mismatch verification device and methods thereof | Mehul D. Shroff, Sanjay R. Parihar | 2014-10-07 |
| 8832624 | Multi-layer process-induced damage tracking and remediation | Mehul D. Shroff, Douglas M. Reber | 2014-09-09 |
| 8796841 | Semiconductor device with embedded heat spreading | Douglas M. Reber, Mehul D. Shroff | 2014-08-05 |
| 8741743 | Integrated assist features for epitaxial growth | Omar Zia, Nigel G. Cave, Venkat R. Kolagunta, Ruiqi Tian | 2014-06-03 |