Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072062 | Circuit device with at least partial packaging and method for forming | George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more | 2011-12-06 |
| 8053349 | BGA package with traces for plating pads under the chip | Kenneth Robert Rhyner, Kevin Lyne, Peter R. Harper | 2011-11-08 |
| 7622309 | Mechanical integrity evaluation of low-k devices with bump shear | Peng Su, Scott K. Pozder, Jie Zhao | 2009-11-24 |
| 7361987 | Circuit device with at least partial packaging and method for forming | George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more | 2008-04-22 |
| 7247552 | Integrated circuit having structural support for a flip-chip interconnect pad and method therefor | Scott K. Pozder, Kevin J. Hess, Pak K. Leung, Edward O. Travis, Brett P. Wilkerson +1 more | 2007-07-24 |
| 6921975 | Circuit device with at least partial packaging, exposed active surface and a voltage reference plane | George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more | 2005-07-26 |
| 6838776 | Circuit device with at least partial packaging and method for forming | George R. Leal, Jie Zhao, Edward R. Prack, Robert J. Wenzel, Brian D. Sawyer +1 more | 2005-01-04 |