| 10262957 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Jie Chen, Stanley Craig Beddingfield +2 more |
2019-04-16 |
| 9941228 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Jie Chen, Stanley Craig Beddingfield +2 more |
2018-04-10 |
| 9666553 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Jie Chen, Stanley Craig Beddingfield +2 more |
2017-05-30 |
| 8828799 |
Method of forming an integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad |
Peter R. Harper |
2014-09-09 |
| 8674505 |
Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance |
Peter R. Harper |
2014-03-18 |
| 8598048 |
Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad |
Peter R. Harper |
2013-12-03 |
| 8053349 |
BGA package with traces for plating pads under the chip |
Kevin Lyne, David G. Wontor, Peter R. Harper |
2011-11-08 |