| 10262957 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more |
2019-04-16 |
| 9941228 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more |
2018-04-10 |
| 9666553 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more |
2017-05-30 |
| 8436475 |
IC device having low resistance TSV comprising ground connection |
Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield |
2013-05-07 |
| 8431481 |
IC device having low resistance TSV comprising ground connection |
Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield |
2013-04-30 |
| 8178976 |
IC device having low resistance TSV comprising ground connection |
Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield |
2012-05-15 |
| 8154134 |
Packaged electronic devices with face-up die having TSV connection to leads and die pad |
Thomas D. Bonifield, Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza |
2012-04-10 |
| 7790597 |
Solder cap application process on copper bump using solder powder film |
Satyendra Singh Chauhan, Rajiv Dunne, Masood Murtuza |
2010-09-07 |
| 7462783 |
Semiconductor package having a grid array of pin-attached balls |
Gregory E. Howard, Navin Kalidas, Paul J. Hundt |
2008-12-09 |
| 6762498 |
Ball grid array package for high speed devices |
Gregory E. Howard |
2004-07-13 |