Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10262957 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2019-04-16 |
| 9941228 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2018-04-10 |
| 9666553 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Rajen Manicon Murugan, Minhong Mi, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield +2 more | 2017-05-30 |
| 8436475 | IC device having low resistance TSV comprising ground connection | Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield | 2013-05-07 |
| 8431481 | IC device having low resistance TSV comprising ground connection | Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield | 2013-04-30 |
| 8178976 | IC device having low resistance TSV comprising ground connection | Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza, Thomas D. Bonifield | 2012-05-15 |
| 8154134 | Packaged electronic devices with face-up die having TSV connection to leads and die pad | Thomas D. Bonifield, Rajiv Dunne, Satyendra Singh Chauhan, Masood Murtuza | 2012-04-10 |
| 7790597 | Solder cap application process on copper bump using solder powder film | Satyendra Singh Chauhan, Rajiv Dunne, Masood Murtuza | 2010-09-07 |
| 7462783 | Semiconductor package having a grid array of pin-attached balls | Gregory E. Howard, Navin Kalidas, Paul J. Hundt | 2008-12-09 |
| 6762498 | Ball grid array package for high speed devices | Gregory E. Howard | 2004-07-13 |