| 10262957 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Jie Chen, Kenneth Robert Rhyner +2 more |
2019-04-16 |
| 9941228 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Jie Chen, Kenneth Robert Rhyner +2 more |
2018-04-10 |
| 9666553 |
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels |
Rajen Manicon Murugan, Minhong Mi, Gary P. Morrison, Jie Chen, Kenneth Robert Rhyner +2 more |
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| 8304867 |
Crack arrest vias for IC devices |
Robert F. McCarthy |
2012-11-06 |
| 8049119 |
Integrated circuit package having integrated faraday shield |
Jean-Francois Drouard |
2011-11-01 |
| 7741567 |
Integrated circuit package having integrated faraday shield |
Jean-Francois Drouard |
2010-06-22 |
| 6372622 |
Fine pitch bumping with improved device standoff and bump volume |
Qing Tan, Douglas G. Mitchell |
2002-04-16 |
| 5977632 |
Flip chip bump structure and method of making |
— |
1999-11-02 |
| 5726502 |
Bumped semiconductor device with alignment features and method for making the same |
— |
1998-03-10 |
| 5710071 |
Process for underfilling a flip-chip semiconductor device |
Leo M. Higgins, III, John C. Gentile |
1998-01-20 |
