Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5710071 | Process for underfilling a flip-chip semiconductor device | Stanley Craig Beddingfield, Leo M. Higgins, III | 1998-01-20 |
| 5583370 | Tab semiconductor device having die edge protection and method for making the same | Leo M. Higgins, III | 1996-12-10 |