Issued Patents All Time
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Fred T. Brauchler, Burton J. Carpenter, Jinmei Liu, Mariano Layson Ching, Jr., Jinzhong Yao +3 more | 2019-10-15 |
| 10347534 | Variable stealth laser dicing process | Martin Lapke, Hartmut Buenning, Sascha Moeller, Guido Albermann, Michael Zernack | 2019-07-09 |
| 10325876 | Surface finish for wirebonding | Varughese Mathew, Burton J. Carpenter, Chu-Chung Lee, Tu-Anh N. Tran | 2019-06-18 |
| 10249557 | Packaged integrated circuit device and methods | Burton J. Carpenter | 2019-04-02 |
| 10242935 | Packaged semiconductor device and method for forming | Burton J. Carpenter | 2019-03-26 |
| 10037965 | Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material | — | 2018-07-31 |
| 9935079 | Laser sintered interconnections between die | Chee Seng Foong, Trent S. Uehling | 2018-04-03 |
| 9899290 | Methods for manufacturing a packaged device with an extended structure for forming an opening in the encapsulant | — | 2018-02-20 |
| 9685351 | Wire bond mold lock method and structure | — | 2017-06-20 |
| 9508622 | Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion | — | 2016-11-29 |
| 9470652 | Sensing field effect transistor devices and method of their manufacture | Stephen R. Hooper, Raymond M. Roop | 2016-10-18 |
| 9461009 | Method and apparatus for assembling a semiconductor package | Glenn G. Daves | 2016-10-04 |
| 9461012 | Copper ball bond features and structure | Chu-Chung Lee | 2016-10-04 |
| 9324667 | Semiconductor devices with compliant interconnects | Trent S. Uehling, Lawrence S. Klingbeil, Jr., Mostafa Vadipour, Brett P. Wilkerson | 2016-04-26 |
| 9287200 | Packaged semiconductor device | — | 2016-03-15 |
| 9269648 | Thermally enhanced package with lid heat spreader | — | 2016-02-23 |
| 9224651 | Method for plating a semiconductor package lead | — | 2015-12-29 |
| 9219028 | Die-to-die inductive communication devices and methods | Fred T. Brauchler | 2015-12-22 |
| 9111878 | Method for forming a semiconductor device assembly having a heat spreader | Burton J. Carpenter | 2015-08-18 |
| 9111952 | Semiconductor device | Sheila F. Chopin | 2015-08-18 |
| 9093383 | Encapsulant for a semiconductor device | Sheila F. Chopin, Varughese Mathew, Chu-Chung Lee | 2015-07-28 |
| 9059144 | Method for forming die assembly with heat spreader | Burton J. Carpenter, Glenn G. Daves | 2015-06-16 |
| 9012263 | Method for treating a bond pad of a package substrate | Varughese Mathew, Burton J. Carpenter | 2015-04-21 |
| 8970026 | Methods and structures for reducing stress on die assembly | George R. Leal, Tim V. Pham | 2015-03-03 |
| 8955388 | Mold compound compatibility test system and methods thereof | Varughese Mathew, Sheila F. Chopin | 2015-02-17 |