| 10347534 |
Variable stealth laser dicing process |
Hartmut Buenning, Sascha Moeller, Guido Albermann, Michael Zernack, Leo M. Higgins, III |
2019-07-09 |
| 9847258 |
Plasma dicing with blade saw patterned underside mask |
Thomas Rohleder, Hartmut Buenning, Guido Albermann, Sascha Moeller |
2017-12-19 |
| 9812361 |
Combination grinding after laser (GAL) and laser on-off function to increase die strength |
Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder |
2017-11-07 |
| 9601437 |
Plasma etching and stealth dicing laser process |
Guido Albermann, Sascha Moeller, Thomas Rohleder, Hartmut Buenning |
2017-03-21 |
| 9349645 |
Apparatus, device and method for wafer dicing |
Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder, Heiko Backer |
2016-05-24 |
| 9113543 |
Device and use of the device for measuring the density and/or the electron temperature and/or the collision frequency of a plasma |
Ralf Brinkmann, Jens Oberrath, Peter Awakowicz, Thomas Musch, Thomas Mussenbrock +5 more |
2015-08-18 |
| 8809166 |
High die strength semiconductor wafer processing method and system |
Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder |
2014-08-19 |