| 11255438 |
Seal arrangement |
Olaf Nahrwold, Stefan Sindlinger, Boris Traber |
2022-02-22 |
| 11168792 |
Seal arrangement |
Olaf Nahrwold, Stefan Sindlinger, Boris Traber |
2021-11-09 |
| 11011446 |
Semiconductor device and method of making a semiconductor device |
Tonny Kamphuis, Leo van Gemert, Hans van Rijckevorsel, Hartmut Buenning, Steffen Holland +1 more |
2021-05-18 |
| 10347534 |
Variable stealth laser dicing process |
Martin Lapke, Hartmut Buenning, Guido Albermann, Michael Zernack, Leo M. Higgins, III |
2019-07-09 |
| 9847258 |
Plasma dicing with blade saw patterned underside mask |
Thomas Rohleder, Hartmut Buenning, Guido Albermann, Martin Lapke |
2017-12-19 |
| 9812361 |
Combination grinding after laser (GAL) and laser on-off function to increase die strength |
Hartmut Buenning, Guido Albermann, Martin Lapke, Thomas Rohleder |
2017-11-07 |
| 9601437 |
Plasma etching and stealth dicing laser process |
Guido Albermann, Thomas Rohleder, Martin Lapke, Hartmut Buenning |
2017-03-21 |
| 9349645 |
Apparatus, device and method for wafer dicing |
Martin Lapke, Hartmut Buenning, Guido Albermann, Thomas Rohleder, Heiko Backer |
2016-05-24 |
| 9245804 |
Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) |
Christian Zenz, Hartmut Buenning, Leonardus Antonius Elisabeth van Gemert, Tonny Kamphuis |
2016-01-26 |
| 9196537 |
Protection of a wafer-level chip scale package (WLCSP) |
Leonardus Antonius Elisabeth van Gemert, Hartmut Buenning, Tonny Kamphuis, Christian Zenz |
2015-11-24 |
| 8895363 |
Die preparation for wafer-level chip scale package (WLCSP) |
Hartmut Buenning, Guido Albermann, Thomas Rohleder, Michael Zernack |
2014-11-25 |
| 8809166 |
High die strength semiconductor wafer processing method and system |
Hartmut Buenning, Martin Lapke, Guido Albermann, Thomas Rohleder |
2014-08-19 |