Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011446 | Semiconductor device and method of making a semiconductor device | Tonny Kamphuis, Leo van Gemert, Hans van Rijckevorsel, Sascha Moeller, Steffen Holland +1 more | 2021-05-18 |
| 10410922 | Semiconductor device with six-sided protected walls | — | 2019-09-10 |
| 10347534 | Variable stealth laser dicing process | Martin Lapke, Sascha Moeller, Guido Albermann, Michael Zernack, Leo M. Higgins, III | 2019-07-09 |
| 9847258 | Plasma dicing with blade saw patterned underside mask | Thomas Rohleder, Guido Albermann, Sascha Moeller, Martin Lapke | 2017-12-19 |
| 9812361 | Combination grinding after laser (GAL) and laser on-off function to increase die strength | Sascha Moeller, Guido Albermann, Martin Lapke, Thomas Rohleder | 2017-11-07 |
| 9601437 | Plasma etching and stealth dicing laser process | Guido Albermann, Sascha Moeller, Thomas Rohleder, Martin Lapke | 2017-03-21 |
| 9349645 | Apparatus, device and method for wafer dicing | Martin Lapke, Sascha Moeller, Guido Albermann, Thomas Rohleder, Heiko Backer | 2016-05-24 |
| 9245804 | Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) | Christian Zenz, Leonardus Antonius Elisabeth van Gemert, Tonny Kamphuis, Sascha Moeller | 2016-01-26 |
| 9196537 | Protection of a wafer-level chip scale package (WLCSP) | Leonardus Antonius Elisabeth van Gemert, Tonny Kamphuis, Sascha Moeller, Christian Zenz | 2015-11-24 |
| 8987057 | Encapsulated wafer-level chip scale (WLSCP) pedestal packaging | Leonardus Antonius Elisabeth van Gemert, Tonny Kamphuis, Christian Zenz | 2015-03-24 |
| 8895363 | Die preparation for wafer-level chip scale package (WLCSP) | Sascha Moeller, Guido Albermann, Thomas Rohleder, Michael Zernack | 2014-11-25 |
| 8809166 | High die strength semiconductor wafer processing method and system | Sascha Moeller, Martin Lapke, Guido Albermann, Thomas Rohleder | 2014-08-19 |