| 9847258 |
Plasma dicing with blade saw patterned underside mask |
Hartmut Buenning, Guido Albermann, Sascha Moeller, Martin Lapke |
2017-12-19 |
| 9812361 |
Combination grinding after laser (GAL) and laser on-off function to increase die strength |
Hartmut Buenning, Sascha Moeller, Guido Albermann, Martin Lapke |
2017-11-07 |
| 9601437 |
Plasma etching and stealth dicing laser process |
Guido Albermann, Sascha Moeller, Martin Lapke, Hartmut Buenning |
2017-03-21 |
| 9349645 |
Apparatus, device and method for wafer dicing |
Martin Lapke, Hartmut Buenning, Sascha Moeller, Guido Albermann, Heiko Backer |
2016-05-24 |
| 8895363 |
Die preparation for wafer-level chip scale package (WLCSP) |
Hartmut Buenning, Sascha Moeller, Guido Albermann, Michael Zernack |
2014-11-25 |
| 8809166 |
High die strength semiconductor wafer processing method and system |
Hartmut Buenning, Sascha Moeller, Martin Lapke, Guido Albermann |
2014-08-19 |