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Technique for handling diced wafers of integrated circuits |
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Technique for handling diced wafers of integrated circuits |
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2022-11-22 |
| 10896878 |
Integrated circuit saw bow break point |
Antonius Hendrikus Jozef Kamphuis, Johannes Cobussen, Christian Zenz |
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Variable stealth laser dicing process |
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| 9847258 |
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Thomas Rohleder, Hartmut Buenning, Sascha Moeller, Martin Lapke |
2017-12-19 |
| 9812361 |
Combination grinding after laser (GAL) and laser on-off function to increase die strength |
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2017-11-07 |
| 9601437 |
Plasma etching and stealth dicing laser process |
Sascha Moeller, Thomas Rohleder, Martin Lapke, Hartmut Buenning |
2017-03-21 |
| 9349645 |
Apparatus, device and method for wafer dicing |
Martin Lapke, Hartmut Buenning, Sascha Moeller, Thomas Rohleder, Heiko Backer |
2016-05-24 |
| 8895363 |
Die preparation for wafer-level chip scale package (WLCSP) |
Hartmut Buenning, Sascha Moeller, Thomas Rohleder, Michael Zernack |
2014-11-25 |
| 8809166 |
High die strength semiconductor wafer processing method and system |
Hartmut Buenning, Sascha Moeller, Martin Lapke, Thomas Rohleder |
2014-08-19 |
| 8415769 |
Integrated circuits on a wafer and method for separating integrated circuits on a wafer |
Heimo Scheucher, David Ceccarelli |
2013-04-09 |