Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177111 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2019-01-08 |
| 10096555 | Shielded QFN package and method of making | Jan Gulpen | 2018-10-09 |
| 9953903 | Heatsink very-thin quad flat no-leads (HVQFN) package | Tonny Kamphuis, Rintje van der Meulen, Emil Casey Israel | 2018-04-24 |
| 9704823 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2017-07-11 |
| 9653414 | Shielded QFN package and method of making | Jan Gulpen | 2017-05-16 |
| 9466585 | Reducing defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte | 2016-10-11 |
| 9385099 | Die interconnect | Coenraad Cornelis Tak, Marten Oldsen, Hendrik Bouman | 2016-07-05 |
| 9263299 | Exposed die clip bond power package | Emil Casey Israel | 2016-02-16 |
| 9245804 | Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) | Christian Zenz, Hartmut Buenning, Tonny Kamphuis, Sascha Moeller | 2016-01-26 |
| 9196537 | Protection of a wafer-level chip scale package (WLCSP) | Hartmut Buenning, Tonny Kamphuis, Sascha Moeller, Christian Zenz | 2015-11-24 |
| 8987057 | Encapsulated wafer-level chip scale (WLSCP) pedestal packaging | Tonny Kamphuis, Hartmut Buenning, Christian Zenz | 2015-03-24 |
| 8895357 | Integrated circuit and method of manufacturing the same | Tonny Kamphuis, Caroline Catharina Maria Beelen-Hendrikx | 2014-11-25 |
| 8217281 | Package, method of manufacturing a package and frame | Marcus Franciscus Donker | 2012-07-10 |