Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431476 | Method of making a plurality of packaged semiconductor devices | Jetse de Witte, Antonius Hendrikus Jozef Kamphuis | 2019-10-01 |
| 10109564 | Wafer level chip scale semiconductor package | Roelf Anco Jacob Groenhuis, Leo van Gemert, Tonny Kamphuis | 2018-10-23 |
| 10096555 | Shielded QFN package and method of making | Leonardus Antonius Elisabeth van Gemert | 2018-10-09 |
| 9653414 | Shielded QFN package and method of making | Leonardus Antonius Elisabeth van Gemert | 2017-05-16 |
| 9379071 | Single inline no-lead semiconductor package | Tonny Kamphuis, Jan Willem Bergman | 2016-06-28 |
| 8679963 | Fan-out chip scale package | Tonny Kamphuis, Pieter Hochstenbach, Leo van Gemert, Eric Van Grunsven, Marc De Samber | 2014-03-25 |
| 8482136 | Fan-out chip scale package | Tonny Kamphuis, Pieter Hochstenbach, Leo van Gemert, Eric Cornelis Egbertus Van Grunsven, Marc Andre De Samber | 2013-07-09 |