Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10315821 | Component carrier | Jeroen Johannes Maria Zaal, Leo van Gemert, Caroline Catharina Maria Beelen-Hendrikx | 2019-06-11 |
| 10177111 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2019-01-08 |
| 10109564 | Wafer level chip scale semiconductor package | Leo van Gemert, Tonny Kamphuis, Jan Gulpen | 2018-10-23 |
| 9842776 | Integrated circuits and molding approaches therefor | John Suman Nakka, Tonny Kamphuis | 2017-12-12 |
| 9704823 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes | 2017-07-11 |
| 9466585 | Reducing defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte | 2016-10-11 |
| 9418918 | Lead for connection to a semiconductor device | Tim Boettcher | 2016-08-16 |
| 9418919 | Leadless chip carrier having improved mountability | Markus Björn Erik Noren, Fei Ying Wong, Hei Ming Shiu | 2016-08-16 |
| 9263335 | Discrete semiconductor device package and manufacturing method | Tim Boettcher, Sven Walczyk, Rolf Brenner, Emiel de Bruin | 2016-02-16 |
| 9222989 | Manufacturing methods for a sensor package including a lead frame | Paulus Martinus Catharina Hesen, Johannes Wilhelmus Dorotheus Bosch | 2015-12-29 |
| 8981566 | Discrete semiconductor device package and manufacturing method | Tim Boettcher, Sven Walczyk, Rolf Brenner, Emiel de Bruin | 2015-03-17 |
| 8884410 | Method for manufacturing a microelectronic package comprising at least one microelectronic device | Peter Wilhelmus Maria Van De Water, Paulus Martinus Catharina Hesen | 2014-11-11 |
| 8664946 | Sensor packages including a lead frame and moulding body and methods of manufacturing | Paulus Martinus Catharina Hesen, Johannes Wilhelmus Dorotheus Bosch | 2014-03-04 |
| 8508035 | Circuit connector apparatus and method therefor | Sven Walczyk, Emiel Bruin, Rolf Brenner | 2013-08-13 |
| 8183682 | Methods of packaging a semiconductor die and package formed by the methods | Paul Dijkstra | 2012-05-22 |
| 8159826 | Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments | Paul Dijkstra, Hans van Rijckevorsel | 2012-04-17 |
| 7944062 | Air cavity package for a semiconductor die and methods of forming the air cavity package | Paul Dijkstra | 2011-05-17 |
| 7858444 | Electronic device and method of manufacturing thereof | Cornelis Gerardus Schriks, Paul Dijkstra, Peter Wilhelmus Maria Van De Water, Johannus Wilhelmus Weekamp | 2010-12-28 |
| 7514801 | Electronic device and method of manufacturing thereof | Cornelis Gerardus Schriks, Paul Dijkstra, Peter Wilhelmus Maria Van De Water, Johannus Wilhelmus Weekamp | 2009-04-07 |
| 7247938 | Carrier, method of manufacturing a carrier and an electronic device | Paul Dijkstra, Cornelis Gerardus Schriks, Peter Wilhelmus Maria Van De Water | 2007-07-24 |
| 7022588 | Method of manufacturing an electronic component and electronic component obtained by means of said method | Johan Bosman, Peter Wilhelmus Maria Van De Water | 2006-04-04 |
| 5703401 | Miniature semiconductor device for surface mounting | Peter W. M. van de Water, Cornelis Gerardus Schriks | 1997-12-30 |