Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10177111 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte | 2019-01-08 |
| 9704823 | Reduction of defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Roelf Anco Jacob Groenhuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte | 2017-07-11 |
| 9466585 | Reducing defects in wafer level chip scale package (WLCSP) devices | Tonny Kamphuis, Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte | 2016-10-11 |