| 11011446 |
Semiconductor device and method of making a semiconductor device |
Leo van Gemert, Hans van Rijckevorsel, Sascha Moeller, Hartmut Buenning, Steffen Holland +1 more |
2021-05-18 |
| 10177111 |
Reduction of defects in wafer level chip scale package (WLCSP) devices |
Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes |
2019-01-08 |
| 10109564 |
Wafer level chip scale semiconductor package |
Roelf Anco Jacob Groenhuis, Leo van Gemert, Jan Gulpen |
2018-10-23 |
| 9953903 |
Heatsink very-thin quad flat no-leads (HVQFN) package |
Leonardus Antonius Elisabeth van Gemert, Rintje van der Meulen, Emil Casey Israel |
2018-04-24 |
| 9842776 |
Integrated circuits and molding approaches therefor |
John Suman Nakka, Roelf Anco Jacob Groenhuis |
2017-12-12 |
| 9798228 |
Maximizing potential good die per wafer, PGDW |
Hans Cobussen, Heimo Scheucher, Laurentius de Kok |
2017-10-24 |
| 9704823 |
Reduction of defects in wafer level chip scale package (WLCSP) devices |
Roelf Anco Jacob Groenhuis, Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx, Jetse de Witte, Franciscus Henrikus Martinus Swartjes |
2017-07-11 |
| 9466585 |
Reducing defects in wafer level chip scale package (WLCSP) devices |
Leonardus Antonius Elisabeth van Gemert, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx, Franciscus Henrikus Martinus Swartjes, Jetse de Witte |
2016-10-11 |
| 9424507 |
Dual interface IC card components and method for manufacturing the dual-interface IC card components |
Christian Zenz, Johannes Wilhelmus van Rijckevorsel, Bodin Kasemset, David Ceccarelli, Boudewijn van Blokland +1 more |
2016-08-23 |
| 9379071 |
Single inline no-lead semiconductor package |
Jan Gulpen, Jan Willem Bergman |
2016-06-28 |
| 9245804 |
Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) |
Christian Zenz, Hartmut Buenning, Leonardus Antonius Elisabeth van Gemert, Sascha Moeller |
2016-01-26 |
| 9196537 |
Protection of a wafer-level chip scale package (WLCSP) |
Leonardus Antonius Elisabeth van Gemert, Hartmut Buenning, Sascha Moeller, Christian Zenz |
2015-11-24 |
| 8987057 |
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging |
Leonardus Antonius Elisabeth van Gemert, Hartmut Buenning, Christian Zenz |
2015-03-24 |
| 8895357 |
Integrated circuit and method of manufacturing the same |
Leonardus Antonius Elisabeth van Gemert, Caroline Catharina Maria Beelen-Hendrikx |
2014-11-25 |
| 8679963 |
Fan-out chip scale package |
Jan Gulpen, Pieter Hochstenbach, Leo van Gemert, Eric Van Grunsven, Marc De Samber |
2014-03-25 |
| 8482136 |
Fan-out chip scale package |
Jan Gulpen, Pieter Hochstenbach, Leo van Gemert, Eric Cornelis Egbertus Van Grunsven, Marc Andre De Samber |
2013-07-09 |
| 8349708 |
Integrated circuits on a wafer and methods for manufacturing integrated circuits |
Heimo Scheucher, Guido Jozef Maria Dormans |
2013-01-08 |