Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9953903 | Heatsink very-thin quad flat no-leads (HVQFN) package | Leonardus Antonius Elisabeth van Gemert, Tonny Kamphuis, Rintje van der Meulen | 2018-04-24 |
| 9263299 | Exposed die clip bond power package | Leonardus Antonius Elisabeth van Gemert | 2016-02-16 |