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Optical and thermal improvement of a two-sided multi-channel filament |
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Particulate water-activatable luminescent materials |
Marc Andre De Samber, Egbertus Reinier JACOBS, Esther Anna Wilhelmina Gerarda Janssen |
2018-10-23 |
| 10084110 |
Low warpage wafer bonding through use of slotted substrates |
Marc Andre De Samber, Roy Antoin Bastiaan Engelen |
2018-09-25 |
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Liquid immersion transfer of electronics |
Esther Anna Wilhelmina Gerarda Janssen, Marc Andre De Samber, Egbertus Reinier JACOBS |
2018-05-01 |
| 9583676 |
Low warpage wafer bonding through use of slotted substrates |
Marc Andre De Samber, Roy Antoin Bastiaan Engelen |
2017-02-28 |
| 8482136 |
Fan-out chip scale package |
Jan Gulpen, Tonny Kamphuis, Pieter Hochstenbach, Leo van Gemert, Marc Andre De Samber |
2013-07-09 |
| 8416047 |
Inductive components for DC/DC converters and methods of manufacture thereof |
Johannes Wilhelmus Weekamp, Hendrik Johannes Bergveld, Franciscus Adrianus Cornelis Maria Schoofs |
2013-04-09 |
| 8395267 |
Through-substrate via and redistribution layer with metal paste |
Freddy Roozeboom, Franciscus H. M. Sanders, Maria Mathea Antonetta Burghoorn |
2013-03-12 |
| 8138087 |
Method of manufacturing an integrated circuit |
Stephane Morel, Arnoldus Den Dekker, Elisabeth Corinne Rodenburg |
2012-03-20 |
| 7704881 |
Producing a covered through substrate via using a temporary cap layer |
Johan Hendrik Klootwijk, Antonius L. A. M. Kemmeren, Ronald Dekker, Freddy Roozeboom |
2010-04-27 |
