Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183595 | Selective underfill assembly and method therefor | Peter Joseph Hubert Drummen | 2024-12-31 |
| 11963291 | Efficient wave guide transition between package and PCB using solder wall | Michael B. Vincent | 2024-04-16 |
| 11557491 | Selective underfill assembly and method therefor | Peter Joseph Hubert Drummen | 2023-01-17 |
| 11508669 | Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials | Jeroen Johannes Maria Zaal, Michiel van Soestbergen, Romuald Olivier Nicolas Roucou | 2022-11-22 |
| 11011446 | Semiconductor device and method of making a semiconductor device | Tonny Kamphuis, Hans van Rijckevorsel, Sascha Moeller, Hartmut Buenning, Steffen Holland +1 more | 2021-05-18 |
| 10825789 | Underbump metallization dimension variation with improved reliability | Adrianus Buijsman, Jeroen Johannes Maria Zaal, Michiel van Soestbergen, Peter Joseph Hubert Drummen | 2020-11-03 |
| 10615134 | Integrated circuit package | Maristella Spella, Waqas Hassan Syed, Daniele Cavallo, Mingda Huang | 2020-04-07 |
| 10613136 | Apparatus comprising a semiconductor arrangement | Peter Joseph Hubert Drummen | 2020-04-07 |
| 10315821 | Component carrier | Jeroen Johannes Maria Zaal, Roelf Anco Jacob Groenhuis, Caroline Catharina Maria Beelen-Hendrikx | 2019-06-11 |
| 10109564 | Wafer level chip scale semiconductor package | Roelf Anco Jacob Groenhuis, Tonny Kamphuis, Jan Gulpen | 2018-10-23 |
| 8679963 | Fan-out chip scale package | Jan Gulpen, Tonny Kamphuis, Pieter Hochstenbach, Eric Van Grunsven, Marc De Samber | 2014-03-25 |
| 8482136 | Fan-out chip scale package | Jan Gulpen, Tonny Kamphuis, Pieter Hochstenbach, Eric Cornelis Egbertus Van Grunsven, Marc Andre De Samber | 2013-07-09 |