Hendrik Bouman

Issued Patents All Time

Patent #	Title	Co-Inventors	Date
12180066	Sensor package and method of producing the sensor package	Willem Frederik Adrianus Besling, Casper van der Avoort, Coenraad Cornelis Tak, Remco Henricus Wilhelmus Pijnenburg, Olaf Wunnicke	2024-12-31
11293821	Pressure sensor module	Roel Daamen, Kailash Vijayakumar, Remco Henricus Wilhelmus Pijnenburg, Twan Van Lippen	2022-04-05
11001495	Sensor package and method of producing the sensor package	Willem Frederik Adrianus Besling, Casper van der Avoort, Coenraad Cornelis Tak, Remco Henricus Wilhelmus Pijnenburg, Olaf Wunnicke	2021-05-11
10192842	Package for environmental parameter sensors and method for manufacturing a package for environmental parameter sensors	Roel Daamen, Coenraad Cornelis Tak	2019-01-29
9862600	Chip structure	Roel Daamen, Kailash Vijayakumar	2018-01-09
9385099	Die interconnect	Leonardus Antonius Elisabeth van Gemert, Coenraad Cornelis Tak, Marten Oldsen	2016-07-05
9070695	Integrated circuit with sensor and method of manufacturing such an integrated circuit	Roel Daamen, Coenraad Cornelis Tak	2015-06-30