Issued Patents All Time
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325876 | Surface finish for wirebonding | Varughese Mathew, Burton J. Carpenter, Leo M. Higgins, III, Tu-Anh N. Tran | 2019-06-18 |
| 9461012 | Copper ball bond features and structure | Leo M. Higgins, III | 2016-10-04 |
| 9437574 | Electronic component package and method for forming same | Tu-Anh N. Tran | 2016-09-06 |
| 9437459 | Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure | Burton J. Carpenter, Tu-Anh N. Tran | 2016-09-06 |
| 9368470 | Coated bonding wire and methods for bonding using same | Burton J. Carpenter, Tu-Anh N. Tran | 2016-06-14 |
| 9331050 | Localized alloying for improved bond reliability | Kevin J. Hess | 2016-05-03 |
| 9331046 | Integrated circuit package with voltage distributor | Kian Leong Chin, Kevin J. Hess, James P. Johnston, Tu-Anh N. Tran, Heng Keong Yip | 2016-05-03 |
| 9324675 | Structures for reducing corrosion in wire bonds | Burton J. Carpenter, Tu-Anh N. Tran | 2016-04-26 |
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, John G. Arthur, Yin Kheng Au, Chin Teck Siong, Meijiang Song +2 more | 2016-02-09 |
| 9093383 | Encapsulant for a semiconductor device | Sheila F. Chopin, Varughese Mathew, Leo M. Higgins, III | 2015-07-28 |
| 8912667 | Packaged integrated circuit using wire bonds | Robert J. Wenzel, Kevin J. Hess | 2014-12-16 |
| 8907485 | Copper ball bond features and structure | Leo M. Higgins, III | 2014-12-09 |
| 8853867 | Encapsulant for a semiconductor device | Sheila F. Chopin, Varughese Mathew, Leo M. Higgins, III | 2014-10-07 |
| 8791582 | Integrated circuit package with voltage distributor | Kian Leong Chin, Kevin J. Hess, Patrick Johnston, Tu-Anh N. Tran, Heng Keong Yip | 2014-07-29 |
| 8318549 | Molded semiconductor package having a filler material | Kevin J. Hess | 2012-11-27 |
| 8129226 | Power lead-on-chip ball grid array package | James P. Johnston, Tu-Anh N. Tran, James W. Miller, Kevin J. Hess | 2012-03-06 |
| 8105933 | Localized alloying for improved bond reliability | Kevin J. Hess | 2012-01-31 |
| 7829997 | Interconnect for chip level power distribution | Kevin J. Hess, James W. Miller | 2010-11-09 |
| 7821104 | Package device having crack arrest feature and method of forming | Min Ding, Kevin J. Hess, Peng Su | 2010-10-26 |
| 7750465 | Packaged integrated circuit | Kevin J. Hess | 2010-07-06 |
| 7656045 | Cap layer for an aluminum copper bond pad | Kevin J. Hess | 2010-02-02 |
| 7632715 | Method of packaging semiconductor devices | Kevin J. Hess, Robert J. Wenzel | 2009-12-15 |
| 7572680 | Packaged integrated circuit with enhanced thermal dissipation | Kevin J. Hess | 2009-08-11 |
| 7550318 | Interconnect for improved die to substrate electrical coupling | Kevin J. Hess, James W. Miller | 2009-06-23 |
| 7374971 | Semiconductor die edge reconditioning | Yuan Yuan, Kevin J. Hess, Tu-Anh N. Tran, Alan H. Woosley | 2008-05-20 |