Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, John G. Arthur, Chu-Chung Lee, Chin Teck Siong, Meijiang Song +2 more | 2016-02-09 |
| 8933547 | Lead frame with power bar for semiconductor device | Jia Lin Yap, Ahmad Termizi Suhaimi, Seng Kiong Teng, Boon Yew Low, Navas Khan Oratti Kalandar | 2015-01-13 |
| 8853840 | Semiconductor package with inner and outer leads | Pey Fang Hiew, Jia Lin Yap | 2014-10-07 |
| 8450841 | Bonded wire semiconductor device | Li Ting Celina Ong, Zi Song Poh | 2013-05-28 |