Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10211184 | Apparatus and methods for multi-die packaging | Nishant Lakhera, Akhilesh Kumar Singh | 2019-02-19 |
| 9997445 | Substrate interconnections for packaged semiconductor device | Kai Yun Yow, Chee Seng Foong, Bihua He, Lan Chu Tan, Yuan Zang | 2018-06-12 |
| 9721928 | Integrated circuit package having two substrates | Lan Chu Tan, Chetan Verma | 2017-08-01 |
| 9476788 | Semiconductor sensor with gel filled cavity | Charles Bergere | 2016-10-25 |
| 9401345 | Semiconductor device package with organic interposer | Chee Seng Foong, Lan Chu Tan | 2016-07-26 |
| 9299675 | Embedded die ball grid array package | Boon Yew Low, Kesvakumar V. C. Muniandy | 2016-03-29 |
| 9209147 | Method of forming pillar bump | Chee Seng Foong, Lee Fee Ngion, Zi Song Poh | 2015-12-08 |
| 9196598 | Semiconductor device having power distribution using bond wires | Shailesh Kumar, Rishi Bhooshan, Vikas Garg, Chetan Verma | 2015-11-24 |
| 9190355 | Multi-use substrate for integrated circuit | Weng Hoong Chan, Ly Hoon Khoo, Boon Yew Low | 2015-11-17 |
| 9159682 | Copper pillar bump and flip chip package using same | Chee Seng Foong, Boon Yew Low | 2015-10-13 |
| 9064718 | Pre-formed via array for integrated circuit package | Kesvakumar V. C. Muniandy | 2015-06-23 |
| 9034694 | Embedded die ball grid array package | Boon Yew Low, Kesvakumar V. C. Muniandy | 2015-05-19 |
| 8987881 | Hybrid lead frame and ball grid array package | Seng Kiong Teng, Ly Hoon Khoo | 2015-03-24 |
| 8945989 | Stiffened semiconductor die package | Kesvakumar V. C. Muniandy | 2015-02-03 |
| 8933547 | Lead frame with power bar for semiconductor device | Jia Lin Yap, Yin Kheng Au, Ahmad Termizi Suhaimi, Seng Kiong Teng, Boon Yew Low | 2015-01-13 |
| 8853058 | Method of making surface mount stacked semiconductor devices | Kesvakumar V. C. Muniandy, Lan Chu Tan | 2014-10-07 |
| 8836098 | Surface mount semiconductor device with solder ball reinforcement frame | Norazham Mohd Sukemi, Kesvakumar V. C. Muniandy | 2014-09-16 |
| 8810020 | Semiconductor device with redistributed contacts | Chee Seng Foong, Norazham Mohd Sukemi, Kesvakumar V. C. Muniandy | 2014-08-19 |
| 8772913 | Stiffened semiconductor die package | Kesvakumar V. C. Muniandy | 2014-07-08 |
| 8698288 | Flexible substrate with crimping interconnection | Boon Yew Low, Sharon Huey Lin Tay | 2014-04-15 |
| 8669140 | Method of forming stacked die package using redistributed chip packaging | Kesvakumar V. C. Muniandy, Lan Chu Tan | 2014-03-11 |
| 8643189 | Packaged semiconductor die with power rail pads | Boon Yew Low, Lan Chu Tan | 2014-02-04 |
| 8466550 | Semiconductor structure and a method of manufacturing a semiconductor structure | Vaidyanathan Kripesh, Xiaowu Zhang, Chee Houe Khong | 2013-06-18 |