Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10325826 | Substrate with reservoir for die attach adhesive | Chin Teck Siong, Vanessa Tan | 2019-06-18 |
| 9698093 | Universal BGA substrate | Chee Seng Foong, Wen Shi Koh, Wai Yew Lo, Zi Song Poh, Kai Yun Yow | 2017-07-04 |
| 9190355 | Multi-use substrate for integrated circuit | Weng Hoong Chan, Boon Yew Low, Navas Khan Oratti Kalandar | 2015-11-17 |
| 9129951 | Coated lead frame bond finger | Seng Kiong Teng, Wen Shi Koh | 2015-09-08 |
| 9000570 | Semiconductor device with corner tie bars | Weng Hoong Chan, Boon Yew Low | 2015-04-07 |
| 8987881 | Hybrid lead frame and ball grid array package | Seng Kiong Teng, Navas Khan Oratti Kalandar | 2015-03-24 |
| 8283780 | Surface mount semiconductor device | Wai Yew Lo, Wen Shi Koh | 2012-10-09 |