Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12388030 | Semiconductor device with stress relief feature and method therefor | Tzu Ya Fang, Yen-Chih Lin, Jian Nian Chen, Moly Lee, Yi Xie +4 more | 2025-08-12 | |
| 12212479 | Estimation of network latency based on aggregated performance data | Zhengye Liu, Yali Liu | 2025-01-28 | |
| 10325826 | Substrate with reservoir for die attach adhesive | Ly Hoon Khoo, Chin Teck Siong | 2019-06-18 | $23,613,000 |