Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12288770 | Semiconductor packages with embedded wiring on re-distributed bumps | Kuan-Hsiang Mao, Norazham Mohd Sukemi, Tsung Nan Lo, Wen-Hung Huang | 2025-04-29 |
| 11056457 | Semiconductor device with bond wire reinforcement structure | Boon Yew Low, Lan Chu Tan, Wai Yew Lo, Poh Leng Eu | 2021-07-06 |
| 10325826 | Substrate with reservoir for die attach adhesive | Ly Hoon Khoo, Vanessa Tan | 2019-06-18 |
| 9287236 | Flexible packaged integrated circuit | Teck Beng Lau, Chee Seng Foong | 2016-03-15 |
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, John G. Arthur, Yin Kheng Au, Chu-Chung Lee, Meijiang Song +2 more | 2016-02-09 |
| 9165904 | Insulated wire bonding with EFO before second bond | Zi Song Poh, Lan Chu Tan | 2015-10-20 |
| 8809078 | Solar powered IC chip | Teck Beng Lau, Wai Yew Lo, Boon Yew Low | 2014-08-19 |
| 8778704 | Solar powered IC chip | Teck Beng Lau, Wai Yew Lo | 2014-07-15 |