Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056457 | Semiconductor device with bond wire reinforcement structure | Boon Yew Low, Lan Chu Tan, Wai Yew Lo, Chin Teck Siong | 2021-07-06 |
| 9646853 | IC device having patterned, non-conductive substrate | Kai Yun Yow | 2017-05-09 |
| 9196576 | Semiconductor package with stress relief and heat spreader | Kai Yun Yow, Meng Kong Lye, You Ge, Penglin Mei | 2015-11-24 |
| 9165855 | Semiconductor device with die attached heat spreader | Kai Yun Yow | 2015-10-20 |
| 9030000 | Mold cap for semiconductor device | Boon Yew Low, Kai Yun Yow | 2015-05-12 |
| 8643169 | Semiconductor sensor device with over-molded lid | Kai Yun Yow | 2014-02-04 |
| 8501517 | Method of assembling pressure sensor device | Kai Yun Yow | 2013-08-06 |
| 8198143 | Mold and substrate for use with mold | Boon Yew Low, Wai Keong Wong | 2012-06-12 |
| 8078353 | Self monitoring braking system for vehicles | Kai Yun Yow | 2011-12-13 |
| 7985672 | Solder ball attachment ring and method of use | Lan Chu Tan, Cheng Qiang Cui | 2011-07-26 |
| 7956471 | Mold and substrate for use with mold | Boon Yew Low, Wai Keong Wong | 2011-06-07 |
| 7868449 | Semiconductor substrate and method of connecting semiconductor die to substrate | Kai Yun Yow | 2011-01-11 |
| 7759753 | Integrated circuit die, integrated circuit package, and packaging method | Kai Yun Yow | 2010-07-20 |