Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12123523 | Multi pipe connector | David Rusch, Ryan Larsen, Daniel Nourian, Michael Schreiber | 2024-10-22 |
| 11795629 | Articulating channel | Michael Schreiber, David Rusch, Daniel Nourian, Ryan Larsen, Clem Neale Vann, III | 2023-10-24 |
| 9595505 | Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof | Shouhui Chen, Guat Kew Teh | 2017-03-14 |
| 9293395 | Lead frame with mold lock structure | Soo Choong Chee, Stanley Job Doraisamy | 2016-03-22 |
| 9190339 | Method of limiting capillary action of gel material during assembly of pressure sensor | Soon Kang Chan, Voon Kwai Leong | 2015-11-17 |
| 9165869 | Semiconductor device with twisted leads | Soo Choong Chee, Meng Kong Lye | 2015-10-20 |
| 9099363 | Substrate with corner cut-outs and semiconductor device assembled therewith | Yi Mei Leow, Lan Yit Ong | 2015-08-04 |
| 9006874 | Lead frame with grooved lead finger | Kok Leong Chan, Wei Kee Chan | 2015-04-14 |
| 8643159 | Lead frame with grooved lead finger | Kok Leong Chan, Wei Kee Chan | 2014-02-04 |
| 8519519 | Semiconductor device having die pads isolated from interconnect portion and method of assembling same | Beng Siong Lee, Guat Kew Teh | 2013-08-27 |
| 8198143 | Mold and substrate for use with mold | Poh Leng Eu, Boon Yew Low | 2012-06-12 |
| 8016183 | Adjustable clamp system and method for wire bonding die assembly | Sik Pong Lee | 2011-09-13 |
| 7956471 | Mold and substrate for use with mold | Poh Leng Eu, Boon Yew Low | 2011-06-07 |
| 7581331 | Calibration device for nozzle and calibration method for nozzle | Tien Ching Ting, Yong-An Lin, Jin Seng Chan | 2009-09-01 |