Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9595505 | Thermally-enhanced three dimensional system-in-packages and methods for the fabrication thereof | Shouhui Chen, Wai Keong Wong | 2017-03-14 |
| 8519519 | Semiconductor device having die pads isolated from interconnect portion and method of assembling same | Beng Siong Lee, Wai Keong Wong | 2013-08-27 |