Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051642 | QFN semiconductor package, semiconductor package and lead frame | You Ge, Zhijie Wang | 2024-07-30 |
| 11515238 | Power die package | You Ge, Zhijie Wang, Kabir Mirpuri | 2022-11-29 |
| 11456188 | Method of making flexible semiconductor device with graphene tape | You Ge, Zhijie Wang | 2022-09-27 |
| 11171077 | Semiconductor device with lead frame that accommodates various die sizes | You Ge, Zhijie Wang | 2021-11-09 |
| 10787361 | Sensor device with flip-chip die and interposer | Stanley Job Doraisamy, Norazham Mohd Sukemi | 2020-09-29 |
| 10734311 | Hybrid lead frame for semiconductor die package with improved creepage distance | Mariano Layson Ching, Jr., Burton J. Carpenter, Lidong Zhang, Kendall D. Phillips, Quan Chen | 2020-08-04 |
| 10692802 | Flexible semiconductor device with graphene tape | You Ge, Zhijie Wang | 2020-06-23 |
| 10515880 | Lead frame with bendable leads | Jinzhong Yao, Zhigang Bai, Xingshou Pang, Xuesong Xu | 2019-12-24 |
| 10217697 | Semiconductor device and lead frame with high density lead array | Zhijie Wang, Zhigang Bai, You Ge | 2019-02-26 |
| 10217700 | Lead frame for integrated circuit device having J-leads and Gull Wing leads | Zhigang Bai, Jinzhong Yao, Xingshou Pang, Jun Li | 2019-02-26 |
| 10181434 | Lead frame for integrated circuit device having J-leads and gull wing leads | Xingshou Pang, Jinzhong Yao, Zhigang Bai | 2019-01-15 |
| 10041195 | Woven signal-routing substrate for wearable electronic devices | You Ge, Zhijie Wang | 2018-08-07 |
| 9633959 | Integrated circuit die with corner IO pads | Shailesh Kumar, Vikas Garg | 2017-04-25 |
| 9548255 | IC package having non-horizontal die pad and flexible substrate therefor | You Ge, Zhijie Wang | 2017-01-17 |
| 9484289 | Semiconductor device with heat spreader | You Ge, Penglin Mei | 2016-11-01 |
| 9449901 | Lead frame with deflecting tie bar for IC package | Zhijie Wang, Zhigang Bai, You Ge | 2016-09-20 |
| 9379035 | IC package having non-horizontal die pad and lead frame therefor | You Ge, Zhijie Wang | 2016-06-28 |
| 9355945 | Semiconductor device with heat-dissipating lead frame | You Ge, Zhijie Wang | 2016-05-31 |
| 9337140 | Signal bond wire shield | Shailesh Kumar, Rishi Bhooshan, Sumit Varshney, Chetan Verma | 2016-05-10 |
| 9196578 | Common pin for multi-die semiconductor package | Sheau Mei Lim, Pei Fan Tong | 2015-11-24 |
| 9196576 | Semiconductor package with stress relief and heat spreader | Kai Yun Yow, Poh Leng Eu, You Ge, Penglin Mei | 2015-11-24 |
| 9190343 | Semiconductor device with tube based heat spreader | You Ge, Zhijie Wang | 2015-11-17 |
| 9177834 | Power bar design for lead frame-based packages | Chee Seng Foong, Lan Chu Tan, Seng Kiong Teng | 2015-11-03 |
| 9165869 | Semiconductor device with twisted leads | Soo Choong Chee, Wai Keong Wong | 2015-10-20 |
| 9147656 | Semiconductor device with improved shielding | Sumit Varshney, Rishi Bhooshan, Chetan Verma | 2015-09-29 |