Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784112 | Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package | JIAN-CHAO SONG, Jun Li, Mingchuan Han, Jinzhong Yao, Xuesong Xu | 2023-10-10 |
| 11417541 | Protection from metal migration on IC packages | Zhigang Bai, Jinzhong Yao | 2022-08-16 |
| 10515880 | Lead frame with bendable leads | Jinzhong Yao, Zhigang Bai, Meng Kong Lye, Xuesong Xu | 2019-12-24 |
| 10446476 | Packaged integrated circuit having stacked die and method for therefor | Leo M. Higgins, III, Fred T. Brauchler, Burton J. Carpenter, Jinmei Liu, Mariano Layson Ching, Jr. +3 more | 2019-10-15 |
| 10217700 | Lead frame for integrated circuit device having J-leads and Gull Wing leads | Zhigang Bai, Jinzhong Yao, Jun Li, Meng Kong Lye | 2019-02-26 |
| 10181434 | Lead frame for integrated circuit device having J-leads and gull wing leads | Jinzhong Yao, Zhigang Bai, Meng Kong Lye | 2019-01-15 |
| 10037935 | Lead frame with dummy leads for burr mitigation during encapsulation | Zhigang Bai, Jinzhong Yao, Yuan Zang | 2018-07-31 |
| 9443746 | Floating mold tool for semicondcutor packaging | Zhigang Bai, Jinzhong Yao | 2016-09-13 |
| 9416002 | Packaged semiconductor sensor device with lid | Nan Xu, Xuesong Xu | 2016-08-16 |
| 9324637 | Quad flat non-leaded semiconductor package with wettable flank | Zhigang Bai, Nan Xu, Jinzhong Yao | 2016-04-26 |
| 8692387 | Stacked die semiconductor package | Shunan Qiu, Guoliang Gong, Xuesong Xu, Beiyue Yan, Yinghui Li | 2014-04-08 |
| 8481369 | Method of making semiconductor package with improved standoff | Junhua Luo, Jinzhong Yao | 2013-07-09 |