Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11784112 | Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package | JIAN-CHAO SONG, Jun Li, Xingshou Pang, Mingchuan Han, Jinzhong Yao | 2023-10-10 |
| 10515880 | Lead frame with bendable leads | Jinzhong Yao, Zhigang Bai, Xingshou Pang, Meng Kong Lye | 2019-12-24 |
| 9416002 | Packaged semiconductor sensor device with lid | Nan Xu, Xingshou Pang | 2016-08-16 |
| 9391311 | Battery and mobile terminal for detecting battery cell deformation | Feng Xie | 2016-07-12 |
| 9285945 | Method and apparatus for displaying multi-task interface | Jin Xu, Jun Yuan, Yi Lu | 2016-03-15 |
| 9071790 | Remote control method, remote controller, remote control response method and set-top box | Yasong Huang | 2015-06-30 |
| 8802474 | Pressure sensor and method of packaging same | Jinzhong Yao, Wai Yew Lo, Lan Chu Tan | 2014-08-12 |
| 8716846 | Pressure sensor and method of packaging same | Jinzhong Yao, Wai Yew Lo, Lan Chu Tan | 2014-05-06 |
| 8709875 | Power device and method of packaging same | Jinzhong Yao, Zhigang Bai | 2014-04-29 |
| 8692387 | Stacked die semiconductor package | Shunan Qiu, Guoliang Gong, Xingshou Pang, Beiyue Yan, Yinghui Li | 2014-04-08 |
| 8643153 | Semiconductor device with staggered leads | Shunan Qiu, Zhigang Bai, Beiyue Yan, You Ge | 2014-02-04 |
| 8525311 | Lead frame for semiconductor device | Zhigang Bai, Jinzhong Yao | 2013-09-03 |
| 8466539 | MRAM device and method of assembling same | Jun Li, Jianhong Wang, Jinzhong Yao, Wanming Yu | 2013-06-18 |
| 8050048 | Lead frame with solder flow control | Meijiang Song, Jinzhong Yao | 2011-11-01 |
| 7727817 | Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit | Nan Xu, Jinzhong Yao | 2010-06-01 |