Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10847449 | Lead frame with selective patterned plating | Allen Marfil Descartin, Mariano Layson Ching, Jr., Lidong Zhang, Jun Li | 2020-11-24 |
| 9257403 | Copper ball bond interface structure and formation | Tu-Anh N. Tran, John G. Arthur, Yin Kheng Au, Chu-Chung Lee, Chin Teck Siong +2 more | 2016-02-09 |
| 8050048 | Lead frame with solder flow control | Xuesong Xu, Jinzhong Yao | 2011-11-01 |