Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11923275 | Lead-frame assembly, semiconductor package and methods for improved adhesion | Mariano Layson Ching, Jr., Jun Li | 2024-03-05 |
| 10847449 | Lead frame with selective patterned plating | Meijiang Song, Mariano Layson Ching, Jr., Lidong Zhang, Jun Li | 2020-11-24 |
| 10734327 | Lead reduction for improved creepage distance | Mariano Layson Ching, Jr., Burton J. Carpenter, Jinmei Liu, Yit Meng Lee | 2020-08-04 |
| 10151658 | Pressure-sensing integrated circuit device with diaphragm | Mariano Layson Ching, Jr., Alexander M. Arayata | 2018-12-11 |
| 9190353 | Lead frame and substrate semiconductor package | Mariano Layson Ching, Jr., Bo Li | 2015-11-17 |