Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10151658 | Pressure-sensing integrated circuit device with diaphragm | Mariano Layson Ching, Jr., Allen Marfil Descartin | 2018-12-11 |
| 8836091 | Lead frame for semiconductor package with enhanced stress relief | Kai Yun Yow, Jian Wen | 2014-09-16 |
| 8686550 | Method and apparatus for high pressure sensor device | William G. McDonald, Philip H. Bowles, Stephen R. Hooper | 2014-04-01 |