Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10442685 | Microelectronic packages having hermetic cavities and methods for the production thereof | Stephen R. Hooper | 2019-10-15 |
| 10053359 | Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof | Stephen R. Hooper | 2018-08-21 |
| 9891244 | Microelectronic packages having split gyroscope structures and methods for the fabrication thereof | Stephen R. Hooper | 2018-02-13 |
| 9676611 | Sensor device packages and related fabrication methods | Stephen R. Hooper | 2017-06-13 |
| 9604844 | Sequential wafer bonding | Stephen R. Hooper | 2017-03-28 |
| 9499397 | Microelectronic packages having axially-partitioned hermetic cavities and methods for the fabrication thereof | Stephen R. Hooper | 2016-11-22 |
| 9376310 | Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof | Stephen R. Hooper | 2016-06-28 |
| 9365414 | Sensor package having stacked die | Stephen R. Hooper | 2016-06-14 |
| 9359192 | Microelectromechanical systems (MEMS) devices with control circuits and methods of fabrication | Mamur Chowdhury, Vijay Sarihan | 2016-06-07 |
| 9227838 | Cavity-type semiconductor package and method of packaging same | Stephen R. Hooper | 2016-01-05 |
| 9165886 | Sensor packaging method and sensor packages | Paige M. Holm, Stephen R. Hooper, Raymond M. Roop | 2015-10-20 |
| 9108841 | Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof | Stephen R. Hooper | 2015-08-18 |
| 9090454 | Sequential wafer bonding | Stephen R. Hooper | 2015-07-28 |
| 9040355 | Sensor package and method of forming same | Paige M. Holm, Stephen R. Hooper, Raymond M. Roop | 2015-05-26 |
| 9018029 | Vent hole sealing in multiple die sensor device | Paige M. Holm, Stephen R. Hooper, Lianjun Liu, Raymond M. Roop | 2015-04-28 |
| 8962389 | Microelectronic packages including patterned die attach material and methods for the fabrication thereof | William C. Stermer, Jr., Alan J. Magnus | 2015-02-24 |
| 8906747 | Cavity-type semiconductor package and method of packaging same | Stephen R. Hooper | 2014-12-09 |
| 8884413 | Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture | Stephen R. Hooper | 2014-11-11 |
| 8709868 | Sensor packages and method of packaging dies of differing sizes | — | 2014-04-29 |
| 8686550 | Method and apparatus for high pressure sensor device | William G. McDonald, Alexander M. Arayata, Stephen R. Hooper | 2014-04-01 |
| 8659167 | Sensor packaging method and sensor packages | Paige M. Holm, Stephen R. Hooper, Raymond M. Roop | 2014-02-25 |
| 7723224 | Microelectronic assembly with back side metallization and method for forming the same | Darrell G. Hill, Jan Campbell, Terry Daly, Jason R. Fender, Lakshmi N. Ramanathan +1 more | 2010-05-25 |
| 7446017 | Methods and apparatus for RF shielding in vertically-integrated semiconductor devices | Lianjun Liu, Li-Chun Li | 2008-11-04 |
| 6631551 | Method of forming integral passive electrical components on organic circuit board substrates | Washington Morris Mobley, Richard D. Parker, Marion Edmond Ellis | 2003-10-14 |
| 6233817 | Method of forming thick-film hybrid circuit on a metal circuit board | Marion Edmond Ellis, Frans Lautzenhiser, Anthony John Stankavich, Dwadasi Hare Rama Sarma, Washington Morris Mobley | 2001-05-22 |