Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9976406 | Enhanced bandwidth transducer method for well integrity measurement | Mahesh Matam, Patrick Gwin | 2018-05-22 |
| 9690956 | Ultrasonic identification of replaceable component for host system | James M. Dallas | 2017-06-27 |
| 9141834 | Ultrasonic identification of replaceable component for host system | James M. Dallas | 2015-09-22 |
| 9142752 | Low frequency broad band ultrasonic transducers | Eric Molz, Mahesh Matam | 2015-09-22 |
| 9105836 | Enhanced bandwidth transducer for well integrity measurement | Mahesh Matam, Pat Gwin | 2015-08-11 |
| 9078067 | Sounder assembly for explosive environment | James M. Dallas | 2015-07-07 |
| 9050628 | Pulse-echo acoustic transducer | Mahesh Matam | 2015-06-09 |
| 8984945 | System and device for acoustic measuring in a medium | James M. Dallas, Eric Molz | 2015-03-24 |
| 8908889 | Temperature compensated piezoelectric buzzer | Fredric Bernard Grossman, Michael H. Phillips, Ramesh Janardhanam | 2014-12-09 |
| 7476422 | Copper circuit formed by kinetic spray | Alaa A. Elmoursi, Albert B. Campbell, John R. Smith | 2009-01-13 |
| 6949156 | Methods for making and using self-constrained low temperature glass-ceramic unfired tape for microelectronics | Edmar Amaya, J. Thomas Hochheimer | 2005-09-27 |
| 6874378 | Pressure transducer | Anthony John Stankavich, John D. Myers, Terrence Evans | 2005-04-05 |
| 6743534 | Self-constrained low temperature glass-ceramic unfired tape for microelectronics and methods for making and using the same | Edmar Amaya, J. Thomas Hochheimer | 2004-06-01 |
| 6538325 | Multi-layer conductor system with intermediate buffer layer for improved adhesion to dielectrics | — | 2003-03-25 |
| 6328914 | Thick-film paste with insoluble additive | Carl W. Berlin, Bradley H. Carter, Dwadasi Hare Rama Sarma, John K. Isenberg | 2001-12-11 |
| 6233817 | Method of forming thick-film hybrid circuit on a metal circuit board | Marion Edmond Ellis, Anthony John Stankavich, Dwadasi Hare Rama Sarma, Philip H. Bowles, Washington Morris Mobley | 2001-05-22 |
| 6164522 | Method of manufacturing a thick film circuit with constrained adhesive spreading | John K. Isenberg | 2000-12-26 |
| 6150041 | Thick-film circuits and metallization process | Joel F. Downey, Marion Edmond Ellis | 2000-11-21 |
| 6143355 | Print alignment method for multiple print thick film circuits | James E. Walsh, John K. Isenberg | 2000-11-07 |
| 6007867 | Method of manufacturing a thick film circuit with improved dielectric feature definition | James E. Walsh, Carl W. Berlin, John K. Isenberg | 1999-12-28 |
| 5910334 | Method of manufacture for a thick film multi-layer circuit | John K. Isenberg, James E. Walsh, Adam W. Schubring | 1999-06-08 |
| 5680814 | Squeegee device for screen printing processes | James E. Walsh | 1997-10-28 |
| 5527627 | Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit | Dwadasi Hare Rama Sarma, Fred E. Richter, Carl W. Berlin | 1996-06-18 |
| 5524490 | Inductive proximity sensor | Dwadasi H. R. Sarma | 1996-06-11 |
| 5464570 | THFA/PDP thermoset thick films for printed circuits | Bradley H. Carter, Donald A. Ozogar, Dwadasi H. R. Sarma | 1995-11-07 |