Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7574793 | Process of forming a laminate ceramic circuit board | Rhonda Jean Heytens, Carl W. Berlin, Manuel Ray Fairchild, Bruce A. Myers, Daniel Ward | 2009-08-18 |
| 7352585 | Flip chip heat sink package and method | Larry M. Mandel, Kevin M. Gertiser, Suresh K. Chengalva, David W. Zimmerman | 2008-04-01 |
| 7321098 | Laminate ceramic circuit board and process therefor | Rhonda Jean Heytens, Carl W. Berlin, Manuel Ray Fairchild, Bruce A. Myers, Daniel Ward | 2008-01-22 |
| 7205652 | Electronic assembly including multiple substrates | M. Ray Fairchild, Derek B. Workman, Daniel R. Harshbarger | 2007-04-17 |
| 7180745 | Flip chip heat sink package and method | Larry M. Mandel, Kevin M. Gertiser, Suresh K. Chengalva, David W. Zimmerman | 2007-02-20 |
| 6328914 | Thick-film paste with insoluble additive | Frans Lautzenhiser, Carl W. Berlin, Bradley H. Carter, John K. Isenberg | 2001-12-11 |
| 6233817 | Method of forming thick-film hybrid circuit on a metal circuit board | Marion Edmond Ellis, Frans Lautzenhiser, Anthony John Stankavich, Philip H. Bowles, Washington Morris Mobley | 2001-05-22 |
| 5928568 | Thick film circuit having conductor composition with coated metallic particles | Christine Ann Paszkiet | 1999-07-27 |
| 5803343 | Solder process for enhancing reliability of multilayer hybrid circuits | Christine Ann Paszkiet, James Catlin Orem, Christopher Needes | 1998-09-08 |
| 5803344 | Dual-solder process for enhancing reliability of thick-film hybrid circuits | Anthony John Stankavich, Christine Ann Paszkiet, Marion Edmond Ellis | 1998-09-08 |
| 5716552 | Thick-film conductor compostions comprising silver or palladium particles coated with alumina or zirconia | Christine Ann Paszkiet | 1998-02-10 |
| 5527627 | Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit | Frans Lautzenhiser, Fred E. Richter, Carl W. Berlin | 1996-06-18 |
| 5395679 | Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits | Bruce A. Myers, Anil K. Kollipara, Ponnusamy Palanisamy | 1995-03-07 |