Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7616448 | Wrap-around overmold for electronic assembly | Thomas A. Degenkolb, Scott D. Brandenburg, Kin Yean Chow, Ching Meng Fang, Sim Ying Yong | 2009-11-10 |
| 7462077 | Overmolded electronic assembly | Kin Yean Chow, Ching Meng Fang, Sim Ying Yong | 2008-12-09 |
| 7455552 | Overmolded electronic assembly with metal seal ring | Ching Meng Fang, Kin Yean Chow, Sim Ying Yong | 2008-11-25 |
| 7416011 | Electronic assembly having a substrate laminated within a backplate cavity | Timothy D. Garner, Andrew R. Baker | 2008-08-26 |
| 7352585 | Flip chip heat sink package and method | Kevin M. Gertiser, Suresh K. Chengalva, Dwadasi Hare Rama Sarma, David W. Zimmerman | 2008-04-01 |
| 7230829 | Overmolded electronic assembly with insert molded heat sinks | David A. Laudick | 2007-06-12 |
| 7180745 | Flip chip heat sink package and method | Kevin M. Gertiser, Suresh K. Chengalva, Dwadasi Hare Rama Sarma, David W. Zimmerman | 2007-02-20 |
| 6905349 | Technique for connector to printed circuit board decoupling to eliminate flexure | Scott D. Brandenburg, David A. Laudick, Thomas A. Degenkolb, Richard D. Parker | 2005-06-14 |
| 6700195 | Electronic assembly for removing heat from a flip chip | — | 2004-03-02 |