| 7616448 |
Wrap-around overmold for electronic assembly |
Thomas A. Degenkolb, Scott D. Brandenburg, Kin Yean Chow, Ching Meng Fang, Sim Ying Yong |
2009-11-10 |
| 7462077 |
Overmolded electronic assembly |
Kin Yean Chow, Ching Meng Fang, Sim Ying Yong |
2008-12-09 |
| 7455552 |
Overmolded electronic assembly with metal seal ring |
Ching Meng Fang, Kin Yean Chow, Sim Ying Yong |
2008-11-25 |
| 7416011 |
Electronic assembly having a substrate laminated within a backplate cavity |
Timothy D. Garner, Andrew R. Baker |
2008-08-26 |
| 7352585 |
Flip chip heat sink package and method |
Kevin M. Gertiser, Suresh K. Chengalva, Dwadasi Hare Rama Sarma, David W. Zimmerman |
2008-04-01 |
| 7230829 |
Overmolded electronic assembly with insert molded heat sinks |
David A. Laudick |
2007-06-12 |
| 7180745 |
Flip chip heat sink package and method |
Kevin M. Gertiser, Suresh K. Chengalva, Dwadasi Hare Rama Sarma, David W. Zimmerman |
2007-02-20 |
| 6905349 |
Technique for connector to printed circuit board decoupling to eliminate flexure |
Scott D. Brandenburg, David A. Laudick, Thomas A. Degenkolb, Richard D. Parker |
2005-06-14 |
| 6700195 |
Electronic assembly for removing heat from a flip chip |
— |
2004-03-02 |
