Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148677 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Yoke Hor Phua, Bartholomew Liao | 2024-11-19 |
| 11227809 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Yoke Hor Phua, Bartholomew Liao | 2022-01-18 |
| 9627338 | Semiconductor device and method of forming ultra high density embedded semiconductor die package | See Chian Lim, Teck Tiong Tan, Yung Kuan Hsiao, Yoke Hor Phua, Bartholomew Liao | 2017-04-18 |
| 7616448 | Wrap-around overmold for electronic assembly | Thomas A. Degenkolb, Scott D. Brandenburg, Larry M. Mandel, Kin Yean Chow, Sim Ying Yong | 2009-11-10 |
| 7462077 | Overmolded electronic assembly | Kin Yean Chow, Larry M. Mandel, Sim Ying Yong | 2008-12-09 |
| 7455552 | Overmolded electronic assembly with metal seal ring | Kin Yean Chow, Larry M. Mandel, Sim Ying Yong | 2008-11-25 |
| 6319450 | Encapsulated circuit using vented mold | Kok Hua Chua, Kim Hwee Tan | 2001-11-20 |