Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8859333 | Integrated circuit package and a method for dissipating heat in an integrated circuit package | Budi Njoman | 2014-10-14 |
| 7776648 | High thermal performance packaging for circuit dies | Budi Njoman, Zheng Xiong | 2010-08-17 |
| 6412680 | Dual-in-line BGA ball mounter | Suharto Leo, Hak Meng Tan, Yew Chung Wong | 2002-07-02 |
| 6319450 | Encapsulated circuit using vented mold | Ching Meng Fang, Kim Hwee Tan | 2001-11-20 |
| 6199464 | Method and apparatus for cutting a substrate | JinHan Ju, Kim Hwee Tan | 2001-03-13 |