Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8859333 | Integrated circuit package and a method for dissipating heat in an integrated circuit package | Kok Hua Chua | 2014-10-14 |
| 7776648 | High thermal performance packaging for circuit dies | Kok Hua Chua, Zheng Xiong | 2010-08-17 |